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MSU engineering student from your area shares $50,700 in Micron Scholarships

October 29, 2004 -- From MSU News Service
Bozeman--Thirteen Montana State University engineering students received a combined total of $50,700 in scholarships from Micron Technologies for the current academic year. The Boise-based firm constructs components used in advanced computing, networking and communications products.

Each student received a $3,900 Micron scholarship to attend MSU.

MSU’s Electrical and Computer Engineering Department is one of ten university programs included in Micron’s elite group of “Key Schools.”

“Micron is the number-one manufacturer of computer memory in the entire world, and we are very proud that they have singled out MSU for this prestigious program,” said Robert Marley, dean of MSU's College of Engineering.

Beyond Micron’s scholarship support, the College of Engineering students are offered a vigorous internship program, in-kind donations and prime career opportunities. In the past three years, Micron has recruited more than ten MSU College of Engineering graduates. Micron is considered the world’s leading provider of advanced semiconductor solutions.


Billings
Dominic Lombardozzi, senior, electrical engineering

Bozeman
Gabe Rudy, junior, computer science
Lucas Cordingley, senior, computer science
Edward Davis, senior, computer science

Colstrip
Reginald Mead, junior, computer science

Great Falls
John Wong, junior, computer engineering

Hamilton
Chris Stephani, junior, electrical engineering

Harlowton
Dallas Fischer, senior, computer science

Pinesdale
Loren Lee, junior, electrical engineering

Seeley Lake
Angela Kimmel, senior, double major in computer science and electrical engineering

Out-of-State

Klamath Falls, Oregon
Carson Greer Drew, senior, computer engineering

Homer, Alaska
Clayton Russell Smith, senior, electrical engineering

Gillette, Wyoming
Benjamin Poelstra, junior, computer science

Contact Linda Wyckoff, 994-2223



View Text-only Version Text-only             Email this article Email this article Updated: 10/29/2004
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